Primarily used for the production of lead frames in semiconductor and IC packaging. Mechanical Press maintains high linear guidance precision during high-speed strokes, making it suitable for challenging lead frame processing such as micro-pitch and ultra-thin materials. It provides stable and reliable production capabilities for industries including LED and IC packaging.
Technical Specifications
| Press capacity (kN) | 400 |
| Stroke (mm) | 16/20/25/30 |
| Stroke speed | 200-1250/200-1200/200-1050/200-900 strokes per minute |
| Shut height (mm) | 190-240 |
| Slide adjustment (mm) | 50 |
| Slide area (mm) | 600×300 |
| Worktable size (bolster) (mm) | 600×400 |
| Worktable thickness (mm) | 90 |
| Worktable opening (mm) | 400(upper)×350(lower)×60 |
| Bed opening (mm) | 400×100 |
| Motor (kW) | 11×4P |
| Upper die weight | max. 80kg |
| Total weight (kg) | 6500 |
| Dimensions (mm) | 1780×3075×1210 |
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